UNPARALLELED PERFORMANCE
With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.
Impedance Optimized Topology
By optimizing memory trace width, length and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules to achieve higher DDR5 speed.
Low Signal Loss PCB
Server grade mid-loss or low-loss PCB material is chosen to lower signal loss inside PCB and maintain DDR5 high speed signal transmission.
DDR5 Auto Booster
Automatically Boost the Native DDR5 frequency to 5000MHz while the system is under heavy loading by a single click.
XMP 3.0 User Profile
Define and create your own SPD profile into Native and XMP 3.0 memory modules or apply the pre-tuned profiles to XMP 3.0 User Profile. Two user-defined profiles can be saved, loaded either locally or from/to an external storage device.
– Two empty SPD profiles can be defined by users and carry to next computer
– Transfer DDR5 XMP Booster profiles into XMP 3.0 User Profiles
– Quick memory performance simulation based on user input clock and timing parameters
– Profile save and load function to share your memory parameters online
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new “CPU Upgrade” in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
– Deactivate all E-Core
– Zero compromise on gaming performance
– Up to 20% lower CPU package power
– Up to 5°C lower CPU temperature
OUTSTANDING THERMAL DESIGN
GIGABYTE Motherboards’ Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.
4X Large Surface
Increased surface area up to 4X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
SMART FAN 6
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.
Cooling Features
– High Current Support
Each fan headers support PWM and DC fan and Water Cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
– Precision Control
Multiple temperature/fan speed control points for precise fan curve
– Dual Curve Mode
Slope/Stair dual mode for different user scenario
– Fan Stop
Fan can stop completely below users’ specified temperature point
Smart Fan 6 BIOS UI
1. Improve fan curve UI
We increase control points from 5 to 7 and larger fan speed graph for precise and easier fan curve control.
2. Slope/Stair dual graph mode
Fan curve can be quickly switch with Slope and Stair modes for different user scenario. Slope is traditional and intuitive linear fan speed curve. With newly added Stair non-linear mode, fan keeps at same speed between specified temperature interval.
3. Manual Input
For advanced users, we provide fan speed manual input for more precise control.
4. EZ Tuning
Use can place 4 EZ Tuning points at rough temperature/fan speed, and Smart Fan 6 can quickly generate a fan curve.
5. Fan curve profile
Fan curve profile can be saved in BIOS ROM, profile will be kept after updating BIOS.
CONNECTIVITY
GIGABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, and Wi-Fi connectivity.
Four PCIe 4.0×4 M.2
GIGABYTE Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system’s potential.
802.11ax Wi-Fi 6E
Latest Wireless solution 802.11ax Wi-Fi 6E with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of Wi-Fi 6E
1. Dedicated spectrum in 6GHz band for less interference
2. 5.5X throughput than 802.11ac 1×1
3. 4X better network capacity, no traffic jams especially in those dense area with lots of devices
4. Network efficiency increase for better user experience
Specifications
CPU
LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
Chipset
Intel® Z790 Express Chipset
Memory
Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 memory modules
4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
* Support for HDMI 2.0 version and HDCP 2.3.
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60
* Support for DisplayPort 1.2 version and HDCP 2.3
Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out
LAN
Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Wireless Communication module
Intel® Wi-Fi 6E AX211
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Expansion Slots
CPU:
1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x16 (PCIEX16)
Chipset:
1 x PCI Express x16 slots, supporting PCIe 4.0 and running at x4 (PCIEX4_1)
1 x PCI Express x16 slots, supporting PCIe 3.0 and running at x4 (PCIEX4_2)
Storage Interface
CPU:
1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:
2 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB, M2Q_SB)
1 x M.2 connector (Socket 3, M key, type 22110/2280 SATA and PCIe 4.0 x4/x2 SSD support) (M2M_SB)
6 x SATA 6Gb/s connectors
RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
USB
Chipset:
1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2×2 support
1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header
2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
Chipset+2 USB 2.0 Hubs:
8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
Internal I/O Connectors
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
1 x CPU fan header
1 x water cooling CPU fan header
3 x system fan headers
1 x system fan/water cooling pump header
2 x addressable LED strip headers
2 x RGB LED strip headers
4 x M.2 Socket 3 connectors
6 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB Type-C® header, with USB 3.2 Gen 2 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
2 x Thunderbolt™ add-in card connectors
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x Q-Flash Plus button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper
Back Panel Connectors
4 x USB 2.0/1.1 ports
2 x SMA antenna connectors (2T2R)
2 x USB 3.2 Gen 2 Type-A ports (red)
1 x DisplayPort
1 x HDMI 2.0 port
3 x USB 3.2 Gen 1 ports
1 x USB Type-C® port, with USB 3.2 Gen 2×2 support
1 x RJ-45 port
1 x optical S/PDIF Out connector
2 x audio jacks
I/O Controller
iTE® I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control
BIOS
1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for GIGABYTE Control Center (GCC)
Support for Q-Flash
Support for Q-Flash Plus
Support for Smart Backup
Bundled Software
Norton® Internet Security (OEM version)
LAN bandwidth management software
Operating System
Support for Windows 11 64-bit
Support for Windows 10 64-bit
Form Factor
ATX Form Factor; 30.5cm x 24.4cm